0201YJ2R0QBWTR

The key components of the thin-film production facilities at AVX include : - Class 1000 clean rooms with working areas under laminar-flow hoods of class 100 for cleanliness control. - High vacuum metal deposition systems for high-purity electrode construction. - Photolithography equipment for line definition accuracy down to 2.0μm. - Plasma-enhanced CVD for various dielectric depositions. - Microprocessor-controlled dicing saws for chip separation. - High-speed, high-accuracy sorting to ensure strict tolerance adherence.

The main features of Accu-F® and Accu-P® capacitors as summarized in the document are: - High purity of electrodes for very low and repeatable ESR . - Highly pure, low-K dielectric for high breakdown field, high insulation resistance, and low losses to frequencies above 40GHz . - Enhanced RF power handling capability . - Improved mechanical characteristics . - Internationally agreed sizes with excellent dimensional control . - Ultra Small size chip capacitors (0201) are available . - Tight capacitance tolerances . - Low ESR at UHF, VHF, and microwave frequencies . - High-stability with respect to time, temperature, frequency, and voltage variation . - High temperature nickel/solder-coated terminations as standard to provide excellent solderability and leach resistance . - Minimal batch to batch variability of parameters at high frequency . - The same unique features as the Accu-F® capacitor such as low ESR, high Q, availability of very low capacitance values, and very tight capacitance tolerances . - RF power handling capability allows for usage in both small signal and RF power applications . - Based on well-established thin-film technology and materials . - Final quality inspection includes testing for standard electrical parameters and visual/mechanical characteristics . - Designed for soldering to printed circuit boards or other substrates, able to withstand time/temperature profiles used in both wave and reflow soldering methods . - Suitable for all flexible types of circuit boards such as FR-4, G-10, and alumina . .

The thin-film technology used in Accu-F® and Accu-P® capacitors differs from traditional fired-ceramic technology in several ways. Firstly, the thin-film technology virtually eliminates component variability in dielectric quality, electrode conductivity, and physical size, which are common in fired-ceramic capacitors