Changjiang Electronics Technology said that the company has participated in the packaging and testing business of automotive chips, and its current revenue accounts for about single digits.
Changjiang Electronics Technology is the world’s leading provider of integrated circuit manufacturing and technical services, providing a full range of one-stop services for finished chip manufacturing, including integrated circuit system integration, design simulation, technology development, product certification, mid-wafer testing, and wafer Circle-level mid-channel packaging and testing, system-level packaging and testing, and chip product testing, and can provide direct shipping services to semiconductor customers around the world; it has more than 23,000 employees worldwide, and has six production bases in China, South Korea and Singapore. Two R&D centers, with business organizations in more than 22 countries and regions, can conduct close technical cooperation with global customers and provide efficient industrial chain support.
It is understood that Changjiang Electronics Technology established a dedicated automotive electronics business center in April 2021. With the help of talents and expertise from the automotive electronics manufacturing field of Japan and South Korea, it will penetrate into the fast-growing automotive electronics market and develop dedicated product platforms and services for automotive electronics. platform.
Through highly integrated wafer-level (WLP), 2.5D/3D, system-level (SiP) packaging technology and high-performance flip-chip and lead interconnect packaging technology, Changjiang Electronics Technology's products, services and technologies cover mainstream integration Circuit system applications, including network communications, mobile terminals, high-performance computing, automotive electronics, big data storage, artificial intelligence and the Internet of Things, industrial intelligent manufacturing and other fields.
Recently, Changjiang Electronics Technology announced the official launch of XDFOI's full series of extremely high-density fan-out packaging solutions. The heterogeneous integration that can effectively improve the IO density and computing power density within the chip is regarded as a new opportunity for the development of advanced packaging and testing technologies. The packaging solution is a new type of through-silicon-via wafer-level very high-density packaging technology. Compared with 2.5D through-silicon-via (TSV) packaging technology, it has higher performance, higher reliability, and lower cost. The solution can achieve 2um line width or line spacing, and can realize multi-layer wiring layer. In addition, it adopts extremely narrow pitch bump interconnection technology, and the package size is large. It can integrate multiple chips, high-bandwidth memory and passive Device. The ultra-high-density wiring has been completed, and the customer sample process is about to begin. Mass production is expected in the second half of next year. The key application areas are: high-performance computing applications such as FPGA, CPU/GPU, AI, 5G, autonomous driving, smart medical, etc.
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